NXP Semiconductors
- Internship - Design of a compact solder joint resistance sensor
- Master's Internship Project: Information-aware signal processing for software-defined EIS
- Graduate AI Software Engineer - Automotive MPUs
- Data Science / Structured Problem Solving Intern - Summer 2027
- Entry Level DFT Design Engineer
- Entry Level NVM Reliability Lab Engineer
- AI and Software Engineer Intern - Automotive MPUs
- Digital Physical Design Intern - P&R
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